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Jesper Smith d8c5620768
Increased size of EEPROM buffer in eepromtool.c
This PR increases the size eepromtool can read/write to 4 megabit, which is the maximum slave devices seem to support according to the datasheets.

Due to space constraints on our device we store some application specific data on our slave that exceeds 32kbyte, hence the need for the ability to read/write larger images to EEPROM.
2018-06-21 09:15:22 +02:00
cmake Integrate SOEM with RTEMS 2018-01-23 17:07:59 +01:00
doc Create and v1.3.3 (skip v1.3.2 due to mistake) 2018-02-02 09:11:17 +01:00
osal Integrate SOEM with RTEMS 2018-01-23 17:07:59 +01:00
oshw Integrate SOEM with RTEMS 2018-01-23 17:07:59 +01:00
soem Fixed windows x64 warning C4267 conversion from size_t to uint16 2018-02-22 15:01:44 -08:00
test Increased size of EEPROM buffer in eepromtool.c 2018-06-21 09:15:22 +02:00
.gitattributes Normalize line endings (#126) 2017-08-16 20:07:39 +02:00
.gitignore delete derived resources 2016-02-16 14:16:00 +01:00
.travis.yml Automated builds (#122) 2017-08-07 17:33:08 +02:00
appveyor.yml Automated builds (#122) 2017-08-07 17:33:08 +02:00
ChangeLog Create and v1.3.3 (skip v1.3.2 due to mistake) 2018-02-02 09:11:17 +01:00
CMakeLists.txt Fixed windows x64 link path 2018-02-22 12:12:59 -08:00
Doxyfile Create and v1.3.3 (skip v1.3.2 due to mistake) 2018-02-02 09:11:17 +01:00
drvcomment.txt Added SOEM 1.3 (hg: a02cedcbdca5) 2014-11-25 16:10:29 +01:00
LICENSE Normalize line endings (#126) 2017-08-16 20:07:39 +02:00
README.md Automated builds (#122) 2017-08-07 17:33:08 +02:00

Simple Open EtherCAT Master Library

Build Status Build status

BUILDING

Prerequisites for all platforms

  • CMake 2.8.0 or later

Windows (Visual Studio)

  • Start a Visual Studio command prompt then:
    • mkdir build
    • cd build
    • cmake .. -G "NMake Makefiles"
    • nmake

Linux

  • mkdir build
  • cd build
  • cmake ..
  • make

Want to contribute to SOEM or SOES?

If you want to contribute to SOEM or SOES you will need to sign a Contributor License Agreement and send it to us either by e-mail or by physical mail. More information is available in the PDF.